Electronic apparatus

ABSTRACT

An electronic apparatus includes an electronic panel foldable together with a window; and a first functional layer and a second functional layer each foldable together with the window and the electronic panel. The second functional layer is disposed farther from the window than the first functional layer, and has a thickness in a range from about 30 micrometers to about 50 micrometers and a modulus in a range from about 3 gigapascals to about 8 gigapascals, and the first functional layer is disposed closer to the window than the second functional layer, and has both a thickness equal to or greater than that of the second functional layer, and a modulus less than that of the second functional layer.

This patent application claims priority to Korean Patent Application No.10-2019-0054399, filed on May 9, 2019, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the entire contents of which are herebyincorporated by reference.

BACKGROUND (1) Field

The present disclosure herein relates to an electronic apparatus, andmore particularly, to a foldable electronic apparatus having improvedreliability.

(2) Description of the Related Art

A bent or folded electronic apparatus has been actively developed. Theflexible electronic apparatus includes an electronic panel such as aflexible display panel or a flexible touch panel, a window for coveringthe electronic panel, and various functional layers. The functionallayers are disposed between the window and the electronic panel. Thewindow and the functional layers are bendable or foldable in conjunctionwith the electronic panel.

Layers of the electronic apparatus have a relatively flexible propertyfor being bent or folded. As having the flexible property, reliabilitywith respect to a stress caused by bending may increase, but reliabilitywith respect to an external impact may decrease.

SUMMARY

The present disclosure provides a foldable electronic apparatus havingimproved impact resistance and improved flexibility.

An embodiment of the invention provides an electronic apparatusincluding: an electronic panel which provides an image and is foldablewith respect to a folding axis; a window which is foldable together withthe electronic panel, with respect to the folding axis, and throughwhich the image from the electronic panel is provided to outside theelectronic apparatus; a first functional layer which is foldabletogether with window and the electronic panel, and disposed between thewindow and the electronic panel; and a second functional layer which isfoldable together with the first functional layer, the window and theelectronic panel, and disposed between the first functional layer andthe electronic panel to be disposed farther from the window than thefirst functional layer. The second functional layer which is disposedfarther from the window than the first functional layer, has a thicknessin a range from about 30 micrometers to about 50 micrometers and amodulus in a range from about 3 gigapascals to about 8 gigapascals, andthe first functional layer which is disposed closer to the window thanthe second functional layer, has both a thickness equal to or greaterthan that of the second functional layer, and a modulus less than thatof the second functional layer.

In an embodiment, the first functional layer may have a thickness in arange from about 50 micrometers (μm) to about 100 μm, and the firstfunctional layer may have a modulus that is variable according totemperature.

In an embodiment, the first functional layer may have a modulus of about200 megapascals (MPa) or more at room temperature.

In an embodiment, the first functional layer may have a thickness in arange from about 50 μm to about 75 μm, and the first functional layermay have a modulus of about 1000 MPa or more at a temperature of about−20° C.

In an embodiment, the first functional layer may have a thickness in arange from about 75 μm to about 100 μm, and the first functional layermay have a modulus in a range from about 1000 MPa to about 1800 MPa at atemperature of about −20° C.

In an embodiment, the first functional layer may have a thickness in arange from about 50 μm to about 75 μm, and the first functional layermay have a modulus of about 100 MPa or more at a temperature of about80° C.

In an embodiment, the first functional layer may have a thickness in arange from about 75 μm to about 100 μm, and the first functional layermay have a modulus of about 150 MPa or more at a temperature of about80° C.

In an embodiment, the electronic apparatus may further include a coverpanel facing the window with the electronic panel, the first functionallayer and the second functional layer therebetween.

In an embodiment, each of the first and second functional layers may beoptically clear.

In an embodiment, the window may include glass.

In an embodiment, the electronic apparatus may further include a coatinglayer on a top surface of the window.

In an embodiment of the invention, an electronic apparatus includes: anelectronic panel which provides an image and is foldable with respect toa folding axis; a window which is foldable together with the electronicpanel, with respect to the folding axis, and through which the imagefrom the electronic panel is provided to outside the electronicapparatus; and a first functional layer and a second functional layereach of which is disposed between the electronic panel and the windowand foldable together with the electronic panel and the window. Thefirst functional layer is disposed closer to the window than the secondfunctional layer, and has both a thickness equal to or greater than athickness of the second functional layer, and a modulus less than amodulus of the second functional layer.

In an embodiment, the second functional layer may have a thickness in arange from about 30 μm to about 50 μm, and the second functional layermay have a modulus in a range from about 3 gigapascals (GPa) to about 8GPa.

In an embodiment, the first functional layer may have a thickness in arange from about 50 μm to about 100 μm, and the first functional layermay have a modulus of about 200 MPa or more at room temperature.

In an embodiment, the first functional layer may have a thickness in arange from about 50 μm to about 75 μm, and the first functional layermay have a modulus of about 1000 MPa or more at a temperature of about−20° C.

In an embodiment, the first functional layer may have a modulus of about100 MPa or more at a temperature of about 80° C.

In an embodiment, the first functional layer may have a thickness in arange from about 75 μm to about 100 μm, and the first functional layermay have a modulus in a range from about 1000 MPa to about 1800 MPa at atemperature of about −20° C.

In an embodiment, the first functional layer may have a modulus of about150 MPa or more at a temperature of about 80° C.

In an embodiment, the first functional layer may include an elastomer.

In an embodiment, the window may include glass.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explainprinciples of the invention. In the drawings:

FIGS. 1A and 1B are perspective views illustrating an embodiment of anelectronic apparatus;

FIGS. 2A and 2B are perspective views illustrating another embodiment ofan electronic apparatus;

FIGS. 3A and 3B are schematic cross-sectional views illustrating anembodiment of an electronic apparatus;

FIG. 4A is an equivalent circuit diagram illustrating an embodiment ofthe electronic apparatus in FIG. 3A;

FIG. 4B is an enlarged cross-sectional view illustrating an embodimentof the electronic apparatus in FIG. 3A;

FIG. 5A is a schematic perspective view illustrating still anotherembodiment of an electronic apparatus;

FIG. 5B is a schematic cross-sectional view of the electronic apparatusin FIG. 5A; and

FIG. 6 is a schematic cross-sectional view illustrating yet anotherembodiment of an electronic apparatus.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. Like reference numerals refer tolike elements throughout. Also, in the figures, the thickness, ratio,and dimensions of components are exaggerated for clarity ofillustration.

In this specification, it will also be understood that when onecomponent (or region, layer, portion) is referred to as being related toanother component such as being ‘on’, ‘connected to’, or ‘coupled to’another component, it can be directly disposed/connected/coupled on/tothe one component, or an intervening third component may also bepresent. In contrast, when one component (or region, layer, portion) isreferred to as being related to another component such as being‘directly on’, ‘directly connected to’, or ‘directly coupled to’ anothercomponent, no intervening third component is present.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein,“a”, “an,” “the,” and “at least one” do not denote a limitation ofquantity, and are intended to include both the singular and plural,unless the context clearly indicates otherwise. For example, “anelement” has the same meaning as “at least one element,” unless thecontext clearly indicates otherwise. “At least one” is not to beconstrued as limiting “a” or “an.” “Or” means “and/or.” The term“and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that although the terms such as ‘first’ and‘second’ are used herein to describe various elements, these elementsshould not be limited by these terms. The terms are only used todistinguish one component from other components. For example, a firstelement referred to as a first element in one embodiment can be referredto as a second element in another embodiment without departing from thescope of the appended claims. The terms of a singular form may includeplural forms unless referred to the contrary.

Also, ““under”, “below”, “above’, “upper”, and the like are used forexplaining relation association of components illustrated in thedrawings. The terms may be a relative concept and described based ondirections expressed in the drawings.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as generally understood bythose skilled in the art. Terms as defined in a commonly used dictionaryshould be construed as having the same meaning as in an associatedtechnical context, and unless defined apparently in the description, theterms are not ideally or excessively construed as having formal meaning.

The meaning of ‘include’ or ‘comprise’ specifies a property, a fixednumber, a step, an operation, an element, a component or a combinationthereof, but does not exclude other properties, fixed numbers, steps,operations, elements, components or combinations thereof.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Embodiments are described herein with reference to cross sectionillustrations that are schematic illustrations of idealized embodiments.As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments described herein should not be construed aslimited to the particular shapes of regions as illustrated herein butare to include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the invention will be described withreference to the accompanying drawings.

FIGS. 1A and 1B are perspective views illustrating an embodiment of anelectronic apparatus EA. As illustrated in FIGS. 1A and 1B, anelectronic apparatus EA may be deformed into various shapes. FIG. 1A isa perspective view illustrating the electronic apparatus EA which is inan unfolded shape or flat shape, and FIG. 1B is a perspective viewillustrating an embodiment of an electronic apparatus EA-F which is in afolded shape or bent shape. The electronic apparatus EA-F in FIG. 1B hasthe same configuration (e.g., components, layers, etc.) as theelectronic apparatus EA in FIG. 1A. Hereinafter, an embodiment of theinvention will be described with reference to FIGS. 1A to 1B.

The electronic apparatus EA and EA-F is driven by receiving anelectrical signal. The electronic apparatus EA may be provided invarious types such as a touch sensing apparatus, a display apparatus,and a touch screen apparatus. However, the invention is not limitedthereto. In the embodiment, the electronic apparatus EA is exemplarilydescribed as a display apparatus for convenience of description.

The electronic apparatus EA may be deformed into various shapes by anexternal force applied to the electronic apparatus EA. The electronicapparatus EA may be unfolded, rolled or partially folded to provide apredetermined curved surface according to a force applied from outsidethe electronic apparatus EA. FIGS. 1A and 1B illustrate shapes accordingto external forces.

As illustrated in FIG. 1A, the electronic apparatus EA may be unfolded.The electronic apparatus EA which is unfolded (hereinafter, referred toas an unfolded electronic apparatus EA) may display an image IM on afront surface FS. The front surface FS may be disposed in a plane whichis parallel to a plane defined by a first direction D1 and a seconddirection D2 which intersect each other. A normal direction to the frontsurface FS (e.g., perpendicular) is a third direction D3 whichintersects the first direction D1 and the second direction D2. Athickness of the electronic apparatus EA and EA-F and/or componentsthereof is defined along the third direction D3. The front surface FSmay include an active area AA and a peripheral area NAA.

The active area AA may display the image IM according to an electricalsignal (e.g., a display area AA). The peripheral area NAA is disposedadjacent to the active area AA. The peripheral area NAA does not displaythe image IM (e.g., a non-display area NAA). A shape of the active areaAA on a plane may be determined by the peripheral area NAA.

As illustrated in FIG. 1B, the electronic apparatus EA-F may be folded.The electronic apparatus EA-F which is folded (hereinafter, referred toas a folded electronic apparatus EA-F) may be folded with respect to afolding axis FX. The folding axis FX may be defined at various positionsalong the electronic apparatus EA and EA-F. In the embodiment, thefolding axis FX is disposed at the front surface FS and lengthwiseextends along the second direction D2. However, the invention is notlimited thereto. In an embodiment, for example, the folding axis FX maybe disposed below the electronic apparatus EA and EA-F such as at a rearsurface opposite to the front surface FS along a thickness of theelectronic apparatus EA and EA-F, may lengthwise extend along the firstdirection D1, or may lengthwise extend along a direction which isinclined or diagonal with respect to the first direction D1 and/or thesecond direction D2. The electronic apparatus EA and EA-F may be foldedor unfolded along the defined folding axis FX. However, the invention isnot limited thereto.

In the embodiment, the electronic apparatus EA is foldable about thefolding axis FX (arrow indicated in FIG. 1B). Thus, the foldedelectronic apparatus EA-F may have a shape in which portions of theactive area AA face each other at an inner area of the folded electronicapparatus EA-F, such as to be covered. The unfolded electronic apparatusEA provides information (e.g., image IM) to outside thereof through theactive area AA and the folded electronic apparatus EA-F stably protectsthe active area AA by disposing portions thereof facing each other alongthe thickness of the folded electronic apparatus EA-F.

FIGS. 2A and 2B are perspective views illustrating another embodiment ofan electronic apparatus EA and an electronic apparatus EA-R (e.g.,electronic apparatus EA and EA-R). FIG. 2A is a perspective viewillustrating an electronic apparatus EA which is unfolded, and FIG. 2Bis a perspective view illustrating an electronic apparatus EA-R which isdeformed to be rolled. The electronic apparatus EA-R in FIG. 2B has thesame configuration as the electronic apparatus EA in FIG. 2A.

In the embodiment, the electronic apparatus EA may have substantiallythe same configuration as the electronic apparatus EA in FIG. 1A.

The electronic apparatus EA may be deformed to be disposed as theelectronic apparatus EA-R (hereinafter, referred to as a rolledelectronic apparatus EA-R). The electronic apparatus EA and EA-R may berolled with respect to a rolling axis RX. The rolling axis RX may bedefined in various positions along the electronic apparatus EA and EA-R.In the embodiment, the rolling axis RX is disposed at the front surfaceFS and on an area overlapping or corresponding to the peripheral areaNAA.

The rolling axis RX is illustrated as an axis lengthwise extending alongthe second direction D2. However, the invention is not limited thereto.In an embodiment, for example, the rolling axis RX may be disposed belowthe front surface FS of the electronic apparatus EA and EA-R such as ata rear surface opposite to the front surface FS along a thickness of theelectronic apparatus EA and EA-R, or may lengthwise extend along adiagonal direction with respect to the first direction D1 or the seconddirection D2 Although the electronic apparatus EA may be rolled orunrolled with respect to the defined rolling axis RX, the invention isnot limited thereto.

In this embodiment, the electronic apparatus EA is rolled about therolling axis RX. Thus, the rolled electronic apparatus EA-R may have ashape in which the active area AA is covered. The electronic apparatusEA and EA-R provides information to a user through the active area AA inthe unrolled state and stably protects the active area AA in the rolledstate.

FIGS. 3A and 3B are schematic cross-sectional views illustrating anembodiment of an electronic apparatus EA and EA-F. FIG. 4A is anequivalent circuit diagram illustrating an embodiment of the electronicapparatus EA in FIG. 3A, and FIG. 4B is an enlarged cross-sectional viewillustrating an embodiment of the electronic apparatus EA in FIG. 3A.

FIG. 3A is a cross-sectional view illustrating the electronic apparatusEA in FIG. 1A, and FIG. 3B is a cross-sectional view illustrating theelectronic apparatus EA-F in FIG. 1B. Hereinafter, an embodiment of theinvention will be described with reference to FIGS. 3A to 4B.

As illustrated in FIGS. 3A and 3B, the electronic apparatus EA and EA-Fincludes a window WM, a plurality of functional layers FL1 and FL2, anelectronic panel EP, a lower cover CP, and a plurality of adhesivelayers AS1, AS2, AS3, and AS4. The adhesive layers AS1, AS2, AS3, andAS4 may include first to fourth adhesive layers AS1, AS2, AS3, and AS4.

The window WM is disposed on the electronic panel EP. The window WM hasa top surface that defines a front surface FS (refer to FIG. 1A) of theelectronic apparatus EA. The window WM may be disposed on a displaysurface of the electronic panel EP, such as the front surface FS. Thewindow WM may be optically clear. Thus, the image IM generated from theelectronic panel EP may pass through the window WM and be easilyrecognized from outside the electronic apparatus EA.

The window WM has a flexible property. Thus, the window WM may befoldable or unfoldable with respect to the folding axis FX. In anembodiment, for example, the window WM may be a resin film including anorganic material.

Alternatively, the window WM may be a glass substrate. Here, the windowWM may have a thickness along the third direction D3, e.g., about 100micrometers (m) or less, to secure rigidity and flexibility at the sametime. Thus, the window WM may have a flexible property while stablyprotecting components of the electronic apparatus EA.

The electronic panel EP has a flexible property. Thus, the electronicpanel EP may be foldable or unfoldable with respect to the folding axisFX. The electronic panel EP may include a display panel DP (FIG. 5B) forgenerating and/or displaying an image, a sensing panel for detecting anexternal pressure thereto, or a combination thereof. In an embodiment,the electronic panel EP includes a display panel DP. Thus, theelectronic panel EP displays the image IM (refer to FIG. 1A). Thedisplay panel DP may be one of a liquid crystal display panel, anorganic light emitting display panel, an electrophoretic display panel,or an electrowetting display panel.

The electronic panel EP may include a pixel PX provided in plurality(e.g., a plurality of pixels PX). Each of the pixels PX may generateand/or emit light for realizing the image IM. In FIG. 4A, an equivalentcircuit diagram of an embodiment of one of the pixels PX is simplyillustrated for ease of description.

As illustrated in FIG. 4A, the pixel PX is electrically connected to aplurality of signal lines. In an embodiment, for example, the pixel PXreceives a gate signal through a gate line GL (e.g., gate signal lineGL) and a data signal through a data line DL (e.g., a data signal lineDL). Also, the pixel PX may receive a first power voltage through apower line PL (e.g., a power signal line PL). The pixel PX may include afirst transistor TR1, a second transistor TR2, a capacitor CAP, and alight emitting element OLD.

The first transistor TR1 outputs a data signal applied to the data lineDL in response to a gate signal applied to the gate line GL. The firsttransistor TR1 may function as a switching element of the pixel PX. Thecapacitor CAP charges an electric charge quantity corresponding to avoltage difference between a signal provided through the firsttransistor TR1 and a power signal provided through the power line PL.

The second transistor TR2 is connected to the light emitting elementOLD. The second transistor TR2 controls an electrical driving currentflowing through the light emitting element OLD in correspondence with anelectric charge quantity stored in the capacitor CAP.

The light emitting element OLD generates and/or emits light according toan electrical signal. The light emitting element OLD may be an organiclight emitting element (“OLED”) including an organic light emittinglayer or a quantum dot light emitting element (“QD-LED”) including aquantum dot. The light emitting element OLD generates and/or emits lightduring a turn-on period of the second transistor TR2.

In FIG. 4B, an enlarged cross-section of the electronic panel EPcorresponding to a portion of the equivalent circuit diagram in FIG. 4Ain which the second transistor TR2 and the light emitting element OLDare disposed. In the embodiment, the light emitting element OLD isexemplarily described as an organic light emitting element.

As illustrated in FIG. 4B, the electronic panel EP may include a basesubstrate BS, a second transistor TR2, a light emitting element OLD, aplurality of insulation layers I1, I2, I3, and I4, and an encapsulationlayer EC.

The base substrate BS may have flexibility and an insulating property.Thus, the base substrate BS may be easily foldable or unfoldable withrespect to the folding axis FX. In the embodiment, the base substrate BSmay include a plurality of layers laminated along the third directionD3. In an embodiment, for example, the base substrate BS may include afirst film layer F1, a first barrier layer B1, a second film layer F2,and a second barrier layer B2.

Each of the first film layer F1 and the second film layer F2 may includean organic material. In an embodiment, for example, each of the firstfilm layer F1 and the second film layer F2 may include a resin such aspolyimide (“PI”). The first film layer F1 and the second film layer F2may include or be made of the same material as or different materialsfrom each other.

Each of the first barrier layer B1 and the second barrier layer B2 mayinclude an inorganic material. The first barrier layer B1 and the secondbarrier layer B2 may be disposed alternately with the first film layerF1 and the second film layer F2, within the base substrate BS. Thus, thefirst barrier layer B1 and the second barrier layer B2 may blockmoisture from permeating to the pixel PX through the first film layer F1and the second film layer F2, and improve an adhesive force betweenelements or layers of the pixel PX and the base substrate BS. In thebase substrate BS, the first barrier layer B1 and the second barrierlayer B2 may be omitted, and the base substrate BS may include only oneof the first film layer F1 and the second film layer F2. However, theinvention is not limited thereto.

The second thin-film transistor TR2 is disposed on the base substrateBS. The second thin-film transistor TR2 includes a semiconductor patternSP, a control electrode CE, an input electrode IE, and an outputelectrode OE.

The semiconductor pattern SP is disposed between the base substrate BSand the first insulation layer I1. The first insulation layer I1 isdisposed on the base substrate BS to cover the semiconductor pattern SP.The first insulation layer I1 includes an organic layer and/or aninorganic layer. The first insulation layer I1 may include a pluralityof thin-films.

The control electrode CE is connected to the first transistor TR1 andthe capacitor CAP. The control electrode CE is disposed between thefirst insulation layer I1 and the second insulation layer I2. Thecontrol electrode CE overlaps the semiconductor pattern SP on a planeand is spaced apart from the semiconductor pattern SP along thethickness direction. The second insulation layer I2 is disposed on thefirst insulation layer I1 to cover the control electrode CE. The secondinsulation layer I2 includes an organic layer and/or an inorganic layer.The second insulation layer I2 may include a plurality of thin-films.

The input electrode IE and the output electrode OE are spaced apart fromeach other along the second insulation layer I2. The input electrode IEis connected to the capacitor CAP, and the output electrode OE isconnected to the light emitting element OLD. The input electrode IE andthe output electrode OE extend through the first insulation layer I1 andthe second insulation layer I2 and are connected to opposing sides ofthe semiconductor pattern SP, respectively.

The light emitting element OLD is disposed on the third insulation layerI3. The third insulation layer I3 is disposed on the second insulationlayer I2 to cover the input electrode IE and the output electrode OE ofthe second thin-film transistor TR2. The third insulation layer I3includes an organic layer and/or an inorganic layer. The thirdinsulation layer I3 may include a plurality of thin-films.

The light emitting element OLD includes a first electrode E1, a lightemitting layer OL, and a second electrode E2. The light emitting elementOLD excites an electric charge of the light emitting layer OL by apotential difference between the first electrode E1 and the secondelectrode E2 to generate and/or emit light.

The first electrode E1 is disposed on the third insulation layer I3. Thefirst electrode E1 extends through the third insulation layer I3 and isconnected to the second thin-film transistor TR2. The first electrode E1receives a voltage corresponding to a data signal from the secondthin-film transistor TR2.

The light emitting layer OL may be disposed on the first electrode E1,and disposed in an opening defined in the fourth insulation layer I4.The fourth insulation layer I4 is disposed on the third insulation layerI3 to provide the opening that exposes at least a portion of the firstelectrode E1 outside of the fourth insulation layer I4. The fourthinsulation layer I4 includes an organic layer and/or an inorganic layer.The fourth insulation layer I4 may include a plurality of thin-films.

The second electrode E2 is disposed on the light emitting layer OL. Thesecond electrode E2 covers the fourth insulation layer I4 and the lightemitting layer OL. The second electrode E2 may be connected to a powerterminal ELV (FIG. 4A) to receive a second power voltage that isdifferent from the first power voltage.

Although not shown, at least one organic layer and/or at least oneinorganic layer may be further disposed between the first electrode E1and the light emitting layer OL and between the second electrode E2 andthe light emitting layer OL. In an embodiment, the light emitting layerOL may be provided in plurality (e.g., a plurality of light emittinglayers OL) spaced apart from each other along the base substrate BS. Thelight emitting element OLD may include various embodiments.

The encapsulation layer EC is disposed on the second electrode E2. Theencapsulation layer EC may include a plurality of thin-films that arearranged in the third direction D3. In an embodiment, for example, theencapsulation layer EC includes a first film L1, a second film L2, and athird film L3 in order from the base substrate BS.

The first film L1 is disposed on the control electrode CE to cover thecontrol electrode CE. The first film L1 may include an inorganicmaterial. The first film L1 protects the second electrode E2 fromexternal moisture or air. The second film L2 is disposed on the firstfilm L1. The second film L2 may have a thickness that is relativelylarger than that of the first film L1. The second film L2 may include anorganic material. The second film L2 provides a flat top surface toplanarize the first film L1 below.

The third film L3 is disposed on the second film L2 to cover the secondfilm L2. The third film L2 encapsulates the second film L2. T electronicpanel EP may include various components according to the type ofelectronic panel EP and/or display panel DP therein.

Referring to FIG. 3A again, the cover panel CP is disposed on a rearsurface of the electronic panel EP. The cover panel CP may have amodulus or an elasticity greater than those of the electronic panel EP.The cover panel CP may reduce or effectively prevent an external impactapplied from a lower side of the electronic apparatus EA from beingtransmitted to the electronic panel EP, to improve reliability of theelectronic apparatus EA.

The functional layers FL1 and FL2 are disposed between the electronicpanel EP and the window WM. The functional layers FL1 and FL2 mayinclude a first functional layer FL1 and a second functional layer FL2.

The first functional layer FL1 may be a layer, which is closer to thewindow WM than the second functional layer FL2, among the functionallayers FL1 and FL2. The first functional layer FL1 has a relatively lowmodulus. The first functional layer FL1 may have a first thickness T1.The first functional layer FL1 may have a different modulus based on arange of the first thickness T1 thereof.

The second functional layer FL2 may be a layer, which is closer to theelectronic panel EP than first functional layer FL1, among thefunctional layers FL1 and FL2. The second functional layer FL2 has arelatively high modulus. The second functional layer FL2 may have asecond thickness T2. The second thickness T2 may be equal to or lessthan the first thickness T1. In an embodiment, for example, the secondfunctional layer FL2 may have a modulus in a range from about 3gigapascals (GPa) to about 8 GPa and a second thickness T2 in a rangefrom about 30 μm to about 50 μm.

Table 1 below shows results of a bending characteristic test of theelectronic apparatus EA according to the thickness and modulus of thefirst functional layer FL1 of components of the electronic apparatus EAin FIG. 3A.

TABLE 1 Temperature Modulus Thickness (Celsius, ° C.) (megapascals MPa)50 μm 75 μm 100 μm Low temperature 800 NG NG NG (−20° C.) 1000 OK OK OK1200 OK OK OK 1500 OK OK OK 1800 OK OK OK 2000 OK NG NG Room 100 NG NGNG temperature 200 OK OK OK (25° C.) 350 OK OK OK 650 OK OK OK 800 OK OKOK 1000 OK OK OK 1500 OK OK OK High temperature 50 NG NG NG (85° C.) 100OK OK NG 150 OK OK OK 300 OK OK OK 400 OK OK OK 600 OK OK OK 800 OK OKOK

The results shown in Table 1 may be experimental results of embodimentsof an electronic apparatus EA that are designed to have the samecomponents as each other except for the thickness and modulus of thefirst functional layer FL1. The bending characteristic test may inspectwhether interlayer delamination is generated when the correspondingembodiment of the electronic apparatus EA is folded with respect to apredetermined folding axis FX as illustrated in FIG. 1B. The term “OK”may represent a case in which the bending characteristics are secured,and the term “NG” may represent a case in which defects such asinterlayer delamination or plastic deformation are generated.

Also, the moduli in the embodiment of the electronic apparatus EA may bevalues obtained by performing a tensile test for each temperature byusing a universal test machine (“UTM”). Here, the tensile test isperformed with a specimen having a width of about 10 millimeters (mm)and a length of about 50 mm, or a specimen having a width of about 25 mmand a length of about 100 mm, at a tensile speed of about 50 millimetersper minute (mm/min).

As shown in Table 1, the modulus of the first functional layer FL1 maybe varied according to temperature. Under a relatively low temperature(−20° C.) condition, the first functional layer FL1 may have a modulusof about 1000 MPa when the first thickness T1 is about 50 μm to about 75μm, and a modulus in a range from about 1000 MPa to about 1800 MPa whenthe first thickness T1 is about 75 μm to about 100 μm.

Also, under a room temperature (25° C.) condition, the first functionallayer FL1 may have a modulus of about 200 MPa or more when the firstthickness T1 is about 50 μm to about 100 μm. Also, under a relativelyhigh temperature (85° C.) condition, the first functional layer FL1 mayhave a modulus of about 100 MPa or more when the first thickness T1 isabout 50 μm to about 75 μm, and a modulus of about 150 MPa or more whenthe first thickness T1 is about 75 μm to about 100 μm.

The first functional layer FL1 may include an elastomer-based material(e.g., an elastomer) that satisfies the above-described thickness andmodulus conditions. In an embodiment, for example, the first functionallayer FL1 may include polyurethane, silicone, polyether block amide(“PEBA”), and copolyester elastomers (“COPE”), which satisfies theabove-described thickness and modulus conditions.

As shown in Table 1, as the thickness (e.g., thickness T1 and T2) andmodulus of each of the first functional layer FL1 and the secondfunctional layer FL2 are controlled in a predetermined numerical range,the electronic apparatus EA may have improved bending characteristics.Thus, although the electronic apparatus EA further includes theplurality of functional layers FL1 and FL2, the electronic apparatus EAmay secure flexibility.

Hereinafter, an impact resistance of the electronic apparatus EA will bedescribed with reference to Table 2 below. The Table 2 below includesresults of an impact resistance test between embodiments and comparativeexamples.

TABLE 2 Modulus (MPa) Low Room High Impact temperature temperaturetemperature Thickness resistance Bending (−20° C.) (25° C.) (85° C.)(μm) (cm) characteristics Reference 7370 6790 6020 50 4 OK embodimentFirst 6150 5500 3580 40 6 OK comparative example Second 1470 1190 940 406 OK comparative example First 1270 830 350 75 10 OK embodiment Second1140 620 110 55 9 OK embodiment Third 1020 400 110 100 11 NG comparativeexample Fourth 920 211 66 110 10 NG comparative example Fifth 950 207 54100 11 NG comparative example

In Table 2, the impact resistance shows result values of heightsgenerated when an impact is applied to a corresponding structure in apen drop type examination. The reference embodiment has a laminatedstructure including the first functional layer FL1 made of a materialhaving a relatively high modulus. In the Reference embodiment, avariation rate of the modulus of the first functional layer FL1according to temperatures may be relatively smaller than that of each ofthe First to Second embodiments and the First to Third comparativeexamples. In the Reference embodiment, the first functional layer FL1 isdesigned to have a thickness of about 50 μm. In case of the Referenceembodiment, although the bending characteristics are excellent, theimpact resistance has a lowest value of about 4 centimeters (cm).

The First and Second comparative examples may include the firstfunctional layer FL1 that is set by a condition outside of the modulusand thickness range according to one or more embodiment of theinvention. The First and Second comparative examples each have athickness less than about 50 μm that is outside of the thickness rangeof the first functional layer FL1 according to one or more embodiment ofthe invention, and do not satisfy the modulus range.

In particular, the First comparative example is designed to include thefirst functional layer FL1 having a thickness of about 40 μm and amodulus of about 6150 MPa under the relatively low temperature (−20° C.)condition, a modulus of about 5500 MPa under the room temperature (25°C.) condition, and a modulus of about 3580 MPa under the relatively hightemperature (85° C.) condition. That is, the first functional layer FL1of the First comparative example has a thickness outside of thethickness range of one or more embodiment of the invention and a modulusoutside of the range of the one or more embodiment of the invention.

The Second comparative example is designed to include the firstfunctional layer FL1 having a thickness of about 40 μm and a modulus ofabout 1470 MPa under the relatively low temperature (−20° C.) condition,a modulus of about 1190 MPa under the room temperature (25° C.)condition, and a modulus of about 940 MPa under the relatively hightemperature (85° C.) condition. That is, the first functional layer FL1of the Second comparative example has a thickness outside of thethickness range of one or more embodiment of the invention and a modulusout of the range of the one or more embodiment of the invention.

Each of the First and Second comparative examples has improved bendingcharacteristics and a relatively improved impact resistance incomparison with the Reference embodiment. However, each of the First andSecond comparative examples has an impact resistance less than about 9cm. In this case, when the electronic apparatus EA is used by a user,the electronic apparatus EA may be relatively easily damaged by anexternal impact. The electronic apparatus EA according to one or moreembodiment of the invention has an impact resistance of at least about 9cm or more. Thus, the electronic apparatus EA having improvedreliability during usage thereof may be provided.

Each of the First and Second embodiments may include the firstfunctional layer FL1 that satisfies the modulus range and thicknessrange in one or more embodiment of the invention. In particular, theFirst embodiment includes the first functional layer FL1 having athickness of about 75 μm. That is, the first functional layer FL1 of theFirst embodiment may have a thickness of about 75 μm to about 100 μm anda modulus in a range from about 1000 MPa to about 1800 MPa under therelatively low temperature (−20° C.) condition, a thickness of about 50μm to about 100 μm and a modulus of about 200 MPa or more under the roomtemperature (25° C.) condition, and a thickness of about 50 μm to about75 μm and a modulus of about 100 MPa or more under the relatively hightemperature (85° C.) condition. The First embodiment has improvedbending characteristics and a relatively high impact resistance toreduce or effectively prevent damage to the electronic apparatus EA evenby an impact related to a height of about 9 cm or more. Also, as thefirst functional layer FL1 of the First embodiment is designed to have amodulus of about 1800 MPa or less under the relatively low temperaturecondition, degradation in bending characteristics and flexibility due toexcessive increase in modulus may be reduced or effectively prevented.

The Second embodiment includes the first functional layer FL1 having athickness of about 55 μm. That is, the first functional layer FL1 of theSecond embodiment satisfies a range of about 1000 MPa or more under therelatively low temperature (−20° C.) condition, a range of about 200 MPaor more under the room temperature (25° C.) condition, and a range ofabout 100 MPa or more under the relatively high temperature (85° C.)condition. The Second embodiment has improved bending characteristicsand an impact resistance of about 5 cm or more in comparison with theReference embodiment.

The Third to Fifth comparative examples each include the firstfunctional layer FL1 which does not satisfy the above conditions for oneor more embodiment of the invention. In particular, the first functionallayer of each of the Third comparative example having a thickness ofabout 100 μm, the Fourth comparative example having a thickness of about110 μm, and the Fifth comparative example having a thickness of about100 μm may have a modulus that is outside of a range from about 1000 MPato 1800 MPa under the relatively low temperature (−20° C.) condition, arange equal to or greater than about 200 MPa under the room temperature(25° C.) condition, and a range equal to or greater than about 150 MPaunder the relatively high temperature (85° C.) condition.

As each of the Third to Fifth comparative examples includes the firstfunctional layer FL1 having a thickness relatively greater than that ofeach of the First and Second comparative examples, each of the Third toFifth comparative examples has an impact resistance that is improvedover that of the Reference embodiment. However, each of the Third toFifth comparative examples is degraded in bending characteristics. TheThird to Fifth comparative examples may improve a protection force ofthe electronic panel EP with respect to an external impact applied tothe electronic apparatus EA, but may be deformed during folding orrolling thereof to become vulnerable to repeated shape deformation ofthe electronic apparatus EA.

The first and second functional layers FL1 and FL2 may be opticallyclear. In an embodiment, for example, each of the first and secondfunctional layers FL1 and FL2 may have a visible transmittance of about90% or more and a haze of about 1% or less. Thus, the image IM displayedby the electronic panel EP may pass through the first and secondfunctional layers FL1 and FL2 and be easily seen from outside theelectronic apparatus EA.

Referring to FIGS. 3A and 3B again, each of the first to fourth adhesivelayers AS1, AS2, AS3, and AS4 may have an adhesive property andflexibility. In an embodiment, for example, each of the first to fourthadhesive layers may include pressure sensitive adhesive (“PSA”).

The first adhesive layer AS1 of the first to fourth adhesive layers AS1,AS2, AS3, and AS4 is disposed between the window WM and the firstfunctional layer FL1 to couple the window WM and the first functionallayer FL1 to each other. The second adhesive layer AS2 is disposedbetween the first functional layer FL1 and the second functional layerFL2 to couple the first functional layer FL1 and the second functionallayer FL2 to each other. The third adhesive layer AS3 is disposedbetween the second functional layer FL2 and the electronic panel EP tocouple the second functional layer FL2 and the electronic panel EP toeach other.

The fourth adhesive layer AS4 is disposed between the electronic panelEP and the cover panel CP to couple the electronic panel EP and thecover panel CP to each other. In an alternative embodiment, the fourthadhesive layer AS4 may be omitted. Here, the cover panel CP may bedirectly disposed on the rear surface of the electronic panel EP andclosely contact the electronic panel EP. However, the invention is notlimited thereto.

The folded electronic apparatus EA-F may be folded about the foldingaxis FX. Each of the components of the electronic apparatus EA is foldedwith respect to the folding axis FX. The window WM, which is closest tothe folding axis FX along the third direction D3, may be folded at afirst curvature radius R1 (e.g., first radius of curvature R1). Thefirst curvature radius R1 may be defined as a distance between a frontsurface FS of the folded electronic apparatus EA-F at the top surface ofthe window WM, to the folding axis FX.

The electronic panel EP that is spaced farthest from the folding axis FXalong the third direction D3 may be folded at a second curvature radiusR2 (e.g., second radius of curvature R2). The second curvature radius R2may be defined as a distance from the rear surface of the electronicpanel EP to the folding axis FX.

In the embodiment, the folding axis FX is defined at the front surfaceof the window WM (e.g., the front surface FS of the electronic apparatusEA). Thus, the second curvature radius R2 is greater in value than thefirst curvature radius R1. Each of the first curvature radius R1 and thesecond curvature radius R2 may be equal to or less than about 2 mm. Theelectronic apparatus EA having the functional layers FL1 and FL2disposed between the window WM and the electronic panel EP according toone or more embodiment of the invention may be stably folded even at amicro curvature radius.

As the thickness and modulus of each of the functional layers FL1 andFL2 disposed between the window WM and the electronic panel EP arecontrolled, the electronic apparatus EA according to one or moreembodiment of the invention may have improved rigidity with respect to afolding stress applied thereto and improved impact resistance withrespect to an external impact applied thereto.

FIG. 5A is a schematic perspective view illustrating still anotherembodiment of an electronic apparatus EA-1. FIG. 5B is a schematiccross-sectional view illustrating the electronic apparatus EA-1 in FIG.5A. Hereinafter, an embodiment of the invention will be described withreference to FIGS. 5A to 5B.

An electronic apparatus EA-1 in FIGS. 5A and 5B includes componentscorresponding those of the electronic apparatus EA in FIG. 2A except foran electronic panel EP-1. The same components as those described inFIGS. 1A to 4B are designated by the same reference numerals, andoverlapped description will be omitted.

As illustrated in FIG. 5A, the electronic apparatus EA-1 may detect anapplied external input TC. Thus, the electronic apparatus EA-1 maydisplay the image IM, which is a function of an output apparatus, andreceive the external input TC, which is a function of an inputapparatus.

Although a user's hand is illustrated as an example of the externalinput TC, the external input TC applied from the outside may be providedin various types. In an embodiment, for example, the external input TCmay include a force, a pressure and/or light in addition to a contact orproximate location generated by an input object (e.g., a portion of ahuman body, stylus pen, etc.). However, the invention is not limitedthereto.

As illustrated in FIG. 5B, the electronic panel EP-1 may include adisplay panel DP and a detection panel TP. The display panel DPgenerates and displays the image IM. The display panel DP maysubstantially correspond to the electronic panel EP in FIG. 4B.Hereinafter, overlapped description will be omitted.

The detection panel TP may include a sensor for detecting the externalinput TC. The sensor may include a plurality of conductive patterns. Theexternal input TC may vary a capacitance between the conductive patternsor provide a new capacitance with the conductive patterns. Also, theexternal input TC may vary resistance of each of the conductivepatterns. The detection panel TP may acquire information regarding aposition and an intensity of the external input TC through a capacitanceor a resistance variation of the sensor.

The detection panel TP may be directly provided on the display panel DP.In an embodiment, for example, the detection panel TP may be directlyprovided on the encapsulation layer EC (refer to FIG. 4B) of theelectronic panel EP. Thus, an additional adhesive member may not beprovided between the detection panel TP and the display panel DP.

In the embodiment, the detection panel TP is disposed on the displaypanel DP to be outside thereof. However, this is exemplarilyillustrated. In an embodiment, for example, the detection panel TP maybe disposed inside the display panel DP or disposed below the displaypanel DP.

According to one or more embodiment of the invention, although theelectronic panel EP-1 includes various components, the stable foldableelectronic apparatus EA-1 may be realized by controlling the thicknessand modulus of each of the first functional layer FL1 and the secondfunctional layer FL2.

FIG. 6 is a schematic cross-sectional view illustrating yet anotherembodiment of an electronic apparatus. FIG. 6 illustrates a structurecorresponding to that in FIG. 3A for easy description. Also, the samecomponents as those described in FIGS. 1A to 5B are designated by thesame reference numerals, and overlapped description will be omitted.

As illustrated in FIG. 6, an electronic apparatus EA-2 may include awindow WM1 and a cover panel CP1, each of which includes a plurality oflayers, in comparison with the electronic apparatus EA in FIG. 3A. Thewindow WM1 may include a base panel BP and a coating layer HC.

The base panel BP may include an insulating material. Also, the basepanel BP may be optically clear. In an embodiment, for example, the basepanel BP may include a resin film such as polyimide (“PI”). The basepanel BP may correspond to the window WM in FIG. 3A.

The coating layer HC contacts the base panel BP to protect the basepanel BP. The coating layer HC may be directly provided on the basepanel BP. However, the invention is not limited thereto. In anembodiment, for example, although predetermined adhesive may be furtherprovided between the coating layer HC and the base panel BP, theinvention is not limited thereto.

The cover panel CP1 may include a first layer CP-L1, a second layerCP-L2, and a fifth adhesive layer AS5. Each of the first layer CP-L1 andthe second layer CP-L2 may include a material having a relatively highelasticity or a material having a relatively high modulus. In anembodiment, for example, each of the first layer CP-L1 and the secondlayer CP-L2 may include an insulating material such as a sponge, rubber,and a resin or metal such as aluminum. The first layer CP-L1 and thesecond layer CP-L2 may be the same as or different from each other. Asthe cover panel CP1 further includes the first layer CP-L1 and thesecond layer CP-L2, the electronic apparatus EA-2 may have improvedbending characteristics and an improved impact resistance.

The fifth adhesive layer AS5 is disposed between the first layer CP-L1and the second layer CP-L2 within the cover panel CP1 to couple thefirst layer CP-L1 and the second layer CP-L2 to each other. The fifthadhesive layer AS5 may have flexibility to be deformable incorrespondence to folding or rolling of the electronic apparatus EA-2.In an embodiment, for example, the fifth adhesive layer AS5 may includepressure sensitive adhesive.

According to one or more embodiment of the invention, although each ofthe window WM1 and the cover panel CP1 includes a plurality of layers,the electronic apparatus EA-2 having the improved bendingcharacteristics and the improved impact resistance may be provided bycontrolling the thickness T1 and T2 and modulus of each of the first andsecond functional layers FL1 and FL2.

According to one or more embodiment of the invention, the flexiblelaminated structure capable of simultaneously securing flexibility andrigidity may be realized by designing the thickness T1 and T2 andmodulus of the plurality of functional layers FL1 and FL2 in apredetermined range. Thus, the electronic apparatus EA that is relievedin stress caused by folding and improved in impact resistance may beprovided.

Although the embodiments of the invention have been described, it isunderstood that the invention should not be limited to these embodimentsbut various changes and modifications can be made by one ordinaryskilled in the art within the spirit and scope of the invention ashereinafter claimed.

Hence, the real protective scope of the invention shall be determined bythe technical scope of the accompanying claims.

What is claimed is:
 1. An electronic apparatus comprising: an electronicpanel which provides an image and is foldable with respect to a foldingaxis; a window which is foldable together with the electronic panel,with respect to the folding axis, and disposed on the electronic panel;a first functional layer which is foldable together with window and theelectronic panel, and disposed between the window and the electronicpanel; and a second functional layer which is foldable together with thefirst functional layer, the window and the electronic panel, anddisposed between the first functional layer and the electronic panel,wherein the second functional layer which is disposed farther from thewindow than the first functional layer, has a thickness in a range fromabout 30 micrometers to about 50 micrometers and a modulus in a rangefrom about 3 gigapascals to about 8 gigapascals, and the firstfunctional layer has both a thickness equal to or greater than that ofthe second functional layer, and a modulus less than that of the secondfunctional layer.
 2. The electronic apparatus of claim 1, wherein thethickness of the first functional layer is in a range from about 50micrometers to about 100 micrometers, and the modulus of the firstfunctional layer is variable according to temperature.
 3. The electronicapparatus of claim 2, wherein the modulus of the first functional layeris about 200 megapascals or more at room temperature.
 4. The electronicapparatus of claim 2, wherein the thickness of the first functionallayer is in a range from about 50 micrometers to about 75 micrometers,and the modulus of the first functional layer is about 1000 megapascalsor more at a temperature of about −20° C.
 5. The electronic apparatus ofclaim 2, wherein the thickness of the first functional layer is in arange from about 75 micrometers to about 100 micrometers, and a modulusof the first functional layer is in a range from about 1000 megapascalsto about 1800 megapascals at a temperature of about −20° C.
 6. Theelectronic apparatus of claim 2, wherein the thickness of the firstfunctional layer is in a range from about 50 micrometers to about 75micrometers, and the modulus of the first functional layer is about 100megapascals or more at a temperature of about 80° C.
 7. The electronicapparatus of claim 2, wherein the thickness of the first functionallayer is in a range from about 75 micrometers to about 100 micrometers,and the modulus of the first functional layer is about 150 megapascalsor more at a temperature of about 80° C.
 8. The electronic apparatus ofclaim 1, further comprising a cover panel facing the window with theelectronic panel, the first functional layer and the second functionallayer therebetween.
 9. The electronic apparatus of claim 1, wherein eachof the first and second functional layers is optically clear.
 10. Theelectronic apparatus of claim 1, wherein the window comprises glass. 11.The electronic apparatus of claim 10, wherein the window furthercomprises a coating layer on a top surface of the window.
 12. Anelectronic apparatus comprising: an electronic panel which provides animage and is foldable with respect to a folding axis; a window which isfoldable together with the electronic panel, with respect to the foldingaxis; and a first functional layer and a second functional layer each ofwhich is disposed between the electronic panel and the window andfoldable together with the electronic panel and the window, wherein thefirst functional layer is disposed closer to the window than the secondfunctional layer and has both a thickness equal to or greater than athickness of the second functional layer, and a modulus less than amodulus of the second functional layer.
 13. The electronic apparatus ofclaim 12, wherein the thickness of the second functional layer is in arange from about 30 micrometers to about 50 micrometers, and the modulusthe second functional layer is in a range from about 3 gigapascals toabout 8 gigapascals.
 14. The electronic apparatus of claim 13, whereinthe thickness of the first functional layer is in a range from about 50micrometers to about 100 micrometers, and the modulus of the firstfunctional layer is about 200 megapascals or more at a room temperature.15. The electronic apparatus of claim 14, wherein the thickness of thefirst functional layer is in a range from about 50 micrometers to about75 micrometers, and the modulus of the first functional layer is about1000 megapascals or more at a temperature of about −20° C.
 16. Theelectronic apparatus of claim 15, wherein the modulus of the firstfunctional layer is about 100 megapascals or more at a temperature ofabout 80° C.
 17. The electronic apparatus of claim 14, wherein thethickness of the first functional layer is in a range from about 75micrometers to about 100 micrometers, and the modulus of the firstfunctional layer is in a range from about 1000 megapascals to about 1800megapascals at a temperature of about −20° C.
 18. The electronicapparatus of claim 17, wherein the modulus of the first functional layeris about 150 megapascals or more at a temperature of about 80° C. 19.The electronic apparatus of claim 14, wherein the first functional layercomprises an elastomer.
 20. The electronic apparatus of claim 12,wherein the window comprises glass.